The first batch of chips manufactured by Samsung 3nm Technology Institute were officially delivered

Source: techweb

    On July 25, according to foreign media reports, as reported by Korean media last week, the first batch of chips manufactured by Samsung Electronics using the 3nm process were officially delivered today, and they also held a delivery ceremony for this purpose.

    According to South Korean media reports, Qing Guixian, CO CEO of Samsung Electronics and head of equipment solutions department, and Lee Chang Yang, Minister of trade, industry and energy of South Korea, attended the delivery ceremony of the first batch of chips in the 3nm process.

    At the delivery ceremony, Qing Guixian said that with the mass production of 3nm process, Samsung Electronics opened a new chapter in the wafer foundry business.

    Samsung Electronics‘ 3nm process began mass production on June 30. Their process is the first to adopt the full surround gate transistor architecture in the industry. The mass production and delivery time are earlier than their competitor TSMC.

    When it was reported last week that Samsung Electronics was scheduled to ship on July 25, foreign media mentioned that the first batch of chips manufactured by their 3nm process were manufactured in the production line of Huacheng, Samsung‘s advanced process technology R & D base, rather than pingze factory with Samsung‘s most advanced chip manufacturing equipment.

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