Infineon launches 650V CoolMOS CFD7A for fast charging of high-efficiency electric vehicles

650 V CooMOS CFD7A

    An efficient and powerful electric vehicle charging system helps to shorten charging time, reduce vehicle weight, improve design flexibility, and lower the overall cost of ownership of the vehicle. This new product series achieves multiple functions and advantageous features through top and bottom cooling packaging, which is an effective supplement to the existing CoolMOS CFD7A product series. The QDPAK TSC (Top Cooling) package enables designers to achieve higher power density and better PCB space utilization.

    The 650 V CoolMOS CFD7A provides multiple important features that support reliable operation in high-voltage applications. Due to the reduction of parasitic inductance, this device can minimize electromagnetic interference (EMI) to the greatest extent possible, ensuring clear signals and stable performance. The Kelvin source pins improve the accuracy of current detection, ensuring measurement accuracy even under harsh conditions. This device has a creepage distance suitable for high-voltage applications, as well as a high current capacity of up to 694 W and high power dissipation (Ptot) capability in a temperature environment of 25 ° C. It is a powerful universal device suitable for various high-voltage applications.

    Using a 650 V CoolMOS CFD7A device based on QDPAK TSC packaging, a new system design will maximize the utilization of PCB space, double power density, and enhance heat dissipation management through board level decoupling. This method simplifies assembly, avoids circuit board stacking, and reduces the need for connectors, thereby reducing system costs. This power switch can reduce thermal resistance by up to 35%, providing higher power dissipation capability than standard cooling solutions.

    This feature overcomes the thermal limitations caused by the use of FR4 PCB in bottom cooling SMD design, significantly improving system performance. The optimized power loop design places the driver near the power switch to improve reliability by reducing stray inductance and chip temperature. In summary, these features contribute to building a cost-effective, robust, and efficient system that can well meet modern charging needs.

    As announced in February 2023, QDPAK TSC packaging suitable for high-power applications has been registered as the JEDEC standard, promoting the widespread adoption of TSC packaging in new designs through a unified standard packaging design and footprint. To further accelerate this transformation, Infineon will also release more automotive grade devices in QDPAK TSC packaging for car chargers and DC-DC converters in 2024, such as 750 V CoolSiC ™ Devices and 1200 V CoolSiC ™ Devices, etc.