Kyocera two factories merged! Improve the production efficiency of precision ceramic and semiconductor components

    The Shiga Hacha Plant and the Shiga Kuro Plant will be the first and second zones of the Shiga Higashi Konie Plant, respectively, with a total area of approximately 442,000 square meters, mainly engaged in the production and manufacturing of fine ceramic parts, semiconductor parts, electronic parts, machine tools, and medical products.
    In the semiconductor industry, manufacturing equipment has an extremely important strategic position. The key semiconductor equipment represented by the lithography machine and the etching machine is a highly integrated product of modern technology, and its design and manufacturing process can reflect the highest level of many related scientific fields, including materials, machining, etc. Compared with metal parts, ceramics are more resistant to heat expansion and corrosion, so they are widely used in semiconductor processing equipment.
    Japan Kyocera was founded in 1959, started with precision ceramic technology, is currently in the world‘s energy production of high-quality precision ceramic enterprises in the leader, it can produce more comprehensive precision ceramic parts for semiconductor equipment, in a series of ceramic parts Kyocera‘s global share reached 70%-80%. So far it has responded to demand by ramping up factory capacity in Kagoshima Prefecture in Kyushu, Japan, and elsewhere.
    In April 2023, Kyocera invested 62 billion yuan in the construction of Kyocera Nagasaki Kaizao Plant, which will produce precision ceramic parts and semiconductor packaging products related to semiconductor manufacturing. This is the company‘s first new plant in Japan since the Kyoto Ayabe plant (Ayabe City, Kyoto Prefecture) opened in 2005. It is worth noting that the current semiconductor market recovery is slow, 2023 Kyocera earnings revised forecast, profit will change from "growth" to "contraction", and cut capital expenditure.
    Kyocera also cut its revenue target for its core components unit, which includes products such as IC substrates, ceramic substrates and Fine Ceramics used in semiconductor manufacturing equipment, to 567 billion yen from 620 billion yen and its profit target to 65 billion yen from 86 billion yen. Revenue targets for the electronic parts division, which includes products such as MLCC and quartz components, were revised down to 358 billion yen from 390 billion yen, while profit targets were cut to 24.5 billion yen from 55 billion yen.